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Related PDFs (6)

Array Datapath Subsystem

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CMOS Circuit Characteristics

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CMOS Delay Characteristics

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CMOS Design Characteristics

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CMOS Power Metrics

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CMOS Time Characteristics

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Capacitance of External Load

Change in Frequency of Clock

Change in Phase of Clock

Delay for Two Inverters in Series

Fanout of Gate

Feedback Clock PLL

Gate Delay

Input Clock Phase PLL

Invertor Electric Effort 1

Invertor Electric Effort 2

Invertor Power

Output Clock Phase PLL

PLL Phase Detector Error

Power Consumption of Chip

Series Resistance from Die to Package

Series Resistance from Package to Air

Stage Effort

Temperature Difference between Transistors

Thermal Resistance between Junction and Ambient

Transfer Function of PLL

C_in Input Capacitance (Picofarad)
C_out Capacitance of External Load (Picofarad)
D_C Delay of Chains (Second)
f Stage Effort
f_abs Absolute Frequency (Hertz)
g Logical Effort
G_d Gate Delay (Second)
h Fanout
h₁ Electric Effort 1 (Milliwatt)
h₂ Electric Effort 2 (Milliwatt)
H_s Transfer Function PLL
N_sr N Bit SRAM
P_chip Power Consumption of Chip (Milliwatt)
P_inv Inverter Power (Milliwatt)
Δf Change in Frequency of Clock (Hertz)
ΔT Temperature Difference Transistors (Kelvin)
ΔΦ_c Feedback Clock PLL
ΔΦ_er PLL Error Detector
ΔΦ_f Change in Phase of Clock
ΔΦ_in Input Reference Clock Phase
Θ_j Thermal Resistance between junction and Ambient (Kelvin per Milliwatt)
Θ_jp Series Resistance from Die to Package (Kelvin per Milliwatt)
Θ_pa Series Resistance from Package to Air (Kelvin per Milliwatt)
Φ_out PLL Output Clock Phase

Measurement: Time in Second (s)
Time Unit Conversion
Measurement: Temperature in Kelvin (K)
Temperature Unit Conversion
Measurement: Power in Milliwatt (mW)
Power Unit Conversion
Measurement: Frequency in Hertz (Hz)
Frequency Unit Conversion
Measurement: Capacitance in Picofarad (pF)
Capacitance Unit Conversion
Measurement: Thermal Resistance in Kelvin per Milliwatt (K/mW)
Thermal Resistance Unit Conversion