Series Resistance from Package to Air Solution

STEP 0: Pre-Calculation Summary
Formula Used
Series Resistance from Package to Air = Thermal Resistance between junction and Ambient-Series Resistance from Die to Package
Θpa = Θj-Θjp
This formula uses 3 Variables
Variables Used
Series Resistance from Package to Air - (Measured in Kelvin per Watt) - Series Resistance from Package to Air is defined as the resistance experienced from package to the air.
Thermal Resistance between junction and Ambient - (Measured in Kelvin per Watt) - Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction.
Series Resistance from Die to Package - (Measured in Kelvin per Watt) - Series Resistance from Die to Package is defined as the resistance experienced from die to the package.
STEP 1: Convert Input(s) to Base Unit
Thermal Resistance between junction and Ambient: 3.01 Kelvin per Milliwatt --> 3010 Kelvin per Watt (Check conversion here)
Series Resistance from Die to Package: 1.6 Kelvin per Milliwatt --> 1600 Kelvin per Watt (Check conversion here)
STEP 2: Evaluate Formula
Substituting Input Values in Formula
Θpa = Θjjp --> 3010-1600
Evaluating ... ...
Θpa = 1410
STEP 3: Convert Result to Output's Unit
1410 Kelvin per Watt -->1.41 Kelvin per Milliwatt (Check conversion here)
FINAL ANSWER
1.41 Kelvin per Milliwatt <-- Series Resistance from Package to Air
(Calculation completed in 00.020 seconds)

Credits

Created by Shobhit Dimri
Bipin Tripathi Kumaon Institute of Technology (BTKIT), Dwarahat
Shobhit Dimri has created this Calculator and 900+ more calculators!
Verified by Urvi Rathod
Vishwakarma Government Engineering College (VGEC), Ahmedabad
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20 CMOS Special Purpose Subsystem Calculators

Series Resistance from Die to Package
Go Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air
Series Resistance from Package to Air
Go Series Resistance from Package to Air = Thermal Resistance between junction and Ambient-Series Resistance from Die to Package
Thermal Resistance between Junction and Ambient
Go Thermal Resistance between junction and Ambient = Temperature Difference Transistors/Power Consumption of Chip
Temperature Difference between Transistors
Go Temperature Difference Transistors = Thermal Resistance between junction and Ambient*Power Consumption of Chip
Power Consumption of Chip
Go Power Consumption of Chip = Temperature Difference Transistors/Thermal Resistance between junction and Ambient
Invertor Power
Go Inverter Power = (Delay of Chains-(Electric Effort 1+Electric Effort 2))/2
Invertor Electric Effort 1
Go Electric Effort 1 = Delay of Chains-(Electric Effort 2+2*Inverter Power)
Invertor Electric Effort 2
Go Electric Effort 2 = Delay of Chains-(Electric Effort 1+2*Inverter Power)
Delay for Two Inverters in Series
Go Delay of Chains = Electric Effort 1+Electric Effort 2+2*Inverter Power
Transfer Function of PLL
Go Transfer Function PLL = PLL Output Clock Phase/Input Reference Clock Phase
Output Clock Phase PLL
Go PLL Output Clock Phase = Transfer Function PLL*Input Reference Clock Phase
Input Clock Phase PLL
Go Input Reference Clock Phase = PLL Output Clock Phase/Transfer Function PLL
PLL Phase Detector Error
Go PLL Error Detector = Input Reference Clock Phase- Feedback Clock PLL
Feedback Clock PLL
Go Feedback Clock PLL = Input Reference Clock Phase-PLL Error Detector
Change in Phase of Clock
Go Change in Phase of Clock = PLL Output Clock Phase/Absolute Frequency
Change in Frequency of Clock
Go Change in Frequency of Clock = Fanout/Absolute Frequency
Capacitance of External Load
Go Capacitance of External Load = Fanout*Input Capacitance
Fanout of Gate
Go Fanout = Stage Effort/Logical Effort
Stage Effort
Go Stage Effort = Fanout*Logical Effort
Gate Delay
Go Gate Delay = 2^(N Bit SRAM)

Series Resistance from Package to Air Formula

Series Resistance from Package to Air = Thermal Resistance between junction and Ambient-Series Resistance from Die to Package
Θpa = Θj-Θjp

What is heat dissipation in packaging?

The heat generated by a chip flows from the transistor junctions where it is generate through the substrate and package. It can be spread across a heat sink, and then carried away through the air by means of convection. Just as current flow is determined by voltage difference and electrical resistance, the heat flow is determined by temperature difference and thermal resistance.

How to Calculate Series Resistance from Package to Air?

Series Resistance from Package to Air calculator uses Series Resistance from Package to Air = Thermal Resistance between junction and Ambient-Series Resistance from Die to Package to calculate the Series Resistance from Package to Air, The Series resistance from package to air formula is defined as resistance experienced from package to air. Series Resistance from Package to Air is denoted by Θpa symbol.

How to calculate Series Resistance from Package to Air using this online calculator? To use this online calculator for Series Resistance from Package to Air, enter Thermal Resistance between junction and Ambient j) & Series Resistance from Die to Package jp) and hit the calculate button. Here is how the Series Resistance from Package to Air calculation can be explained with given input values -> 0.0014 = 3010-1600.

FAQ

What is Series Resistance from Package to Air?
The Series resistance from package to air formula is defined as resistance experienced from package to air and is represented as Θpa = Θjjp or Series Resistance from Package to Air = Thermal Resistance between junction and Ambient-Series Resistance from Die to Package. Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction & Series Resistance from Die to Package is defined as the resistance experienced from die to the package.
How to calculate Series Resistance from Package to Air?
The Series resistance from package to air formula is defined as resistance experienced from package to air is calculated using Series Resistance from Package to Air = Thermal Resistance between junction and Ambient-Series Resistance from Die to Package. To calculate Series Resistance from Package to Air, you need Thermal Resistance between junction and Ambient j) & Series Resistance from Die to Package jp). With our tool, you need to enter the respective value for Thermal Resistance between junction and Ambient & Series Resistance from Die to Package and hit the calculate button. You can also select the units (if any) for Input(s) and the Output as well.
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