PN Junction Depletion Depth with Drain VLSI Solution

STEP 0: Pre-Calculation Summary
Formula Used
P-n Junction Depletion Depth with Drain = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*Acceptor Concentration))*(Junction Built-in Voltage+Drain to Source Potential))
xdD = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*NA))*(Ø0+Vds))
This formula uses 3 Constants, 1 Functions, 4 Variables
Constants Used
[Permitivity-silicon] - Permittivity of silicon Value Taken As 11.7
[Permitivity-vacuum] - Permittivity of vacuum Value Taken As 8.85E-12
[Charge-e] - Charge of electron Value Taken As 1.60217662E-19
Functions Used
sqrt - A square root function is a function that takes a non-negative number as an input and returns the square root of the given input number., sqrt(Number)
Variables Used
P-n Junction Depletion Depth with Drain - (Measured in Meter) - P-n Junction Depletion Depth with Drain is defined as the extension of the depletion region into the semiconductor material near the drain terminal.
Acceptor Concentration - (Measured in 1 per Cubic Meter) - Acceptor Concentration refers to the concentration of acceptor dopant atoms in a semiconductor material.
Junction Built-in Voltage - (Measured in Volt) - Junction Built-in Voltage is defined as the voltage that exists across a semiconductor junction in thermal equilibrium, where no external voltage is applied.
Drain to Source Potential - (Measured in Volt) - Drain to source Potential is potential between drain and source.
STEP 1: Convert Input(s) to Base Unit
Acceptor Concentration: 1E+16 1 per Cubic Centimeter --> 1E+22 1 per Cubic Meter (Check conversion ​here)
Junction Built-in Voltage: 0.76 Volt --> 0.76 Volt No Conversion Required
Drain to Source Potential: 1.45 Volt --> 1.45 Volt No Conversion Required
STEP 2: Evaluate Formula
Substituting Input Values in Formula
xdD = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*NA))*(Ø0+Vds)) --> sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*1E+22))*(0.76+1.45))
Evaluating ... ...
xdD = 5.34466520692296E-07
STEP 3: Convert Result to Output's Unit
5.34466520692296E-07 Meter -->0.534466520692296 Micrometer (Check conversion ​here)
FINAL ANSWER
0.534466520692296 0.534467 Micrometer <-- P-n Junction Depletion Depth with Drain
(Calculation completed in 00.004 seconds)

Credits

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Created by Priyanka Patel
Lalbhai Dalpatbhai College of engineering (LDCE), Ahmedabad
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Verified by Santhosh Yadav
Dayananda Sagar College Of Engineering (DSCE), Banglore
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25 VLSI Material Optimization Calculators

Bulk Depletion Region Charge Density VLSI
​ Go Bulk Depletion Region Charge Density = -(1-((Lateral Extent of Depletion Region with Source+Lateral Extent of Depletion Region with Drain)/(2*Channel Length)))*sqrt(2*[Charge-e]*[Permitivity-silicon]*[Permitivity-vacuum]*Acceptor Concentration*abs(2*Surface Potential))
Body Effect Coefficient
​ Go Body Effect Coefficient = modulus((Threshold Voltage-Threshold Voltage DIBL)/(sqrt(Surface Potential+(Source Body Potential Difference))-sqrt(Surface Potential)))
Junction Built-in Voltage VLSI
​ Go Junction Built-in Voltage = ([BoltZ]*Temperature/[Charge-e])*ln(Acceptor Concentration*Donor concentration/(Intrinsic Concentration)^2)
PN Junction Depletion Depth with Source VLSI
​ Go P-n Junction Depletion Depth with Source = sqrt((2*[Permitivity-silicon]*[Permitivity-vacuum]*Junction Built-in Voltage)/([Charge-e]*Acceptor Concentration))
Total Source Parasitic Capacitance
​ Go Source Parasitic Capacitance = (Capacitance between Junction of Body and Source*Area of Source Diffusion)+(Capacitance between Junction of Body and Side wall*Sidewall Perimeter of Source Diffusion)
Short Channel Saturation Current VLSI
​ Go Short Channel Saturation Current = Channel Width*Saturation Electron Drift Velocity*Oxide Capacitance per Unit Area*Saturation Drain Source Voltage
Junction Current
​ Go Junction Current = (Static Power/Base Collector Voltage)-(Sub Threshold Current+Contention Current+Gate Current)
Surface Potential
​ Go Surface Potential = 2*Source Body Potential Difference*ln(Acceptor Concentration/Intrinsic Concentration)
DIBL Coefficient
​ Go DIBL Coefficient = (Threshold Voltage DIBL-Threshold Voltage)/Drain to Source Potential
Threshold Voltage when Source is at Body Potential
​ Go Threshold Voltage DIBL = DIBL Coefficient*Drain to Source Potential+Threshold Voltage
Subthreshold Slope
​ Go Sub Threshold Slope = Source Body Potential Difference*DIBL Coefficient*ln(10)
Threshold Voltage
​ Go Threshold Voltage = Gate to Channel Voltage-(Channel Charge/Gate Capacitance)
Gate Capacitance
​ Go Gate Capacitance = Channel Charge/(Gate to Channel Voltage-Threshold Voltage)
Channel Charge
​ Go Channel Charge = Gate Capacitance*(Gate to Channel Voltage-Threshold Voltage)
Gate Length using Gate Oxide Capacitance
​ Go Gate Length = Gate Capacitance/(Capacitance of Gate Oxide Layer*Gate Width)
Gate Oxide Capacitance
​ Go Capacitance of Gate Oxide Layer = Gate Capacitance/(Gate Width*Gate Length)
Oxide Capacitance after Full Scaling VLSI
​ Go Oxide Capacitance after Full Scaling = Oxide Capacitance per Unit Area*Scaling Factor
Critical Voltage
​ Go Critical Voltage = Critical Electric Field*Electric Field Across Channel Length
Gate Oxide Thickness after Full Scaling VLSI
​ Go Gate Oxide Thickness after Full Scaling = Gate Oxide Thickness/Scaling Factor
Intrinsic Gate Capacitance
​ Go MOS Gate Overlap Capacitance = MOS Gate Capacitance*Transition Width
Channel Length after Full Scaling VLSI
​ Go Channel Length after Full Scaling = Channel Length/Scaling Factor
Junction Depth after Full Scaling VLSI
​ Go Junction Depth after Full Scaling = Junction Depth/Scaling Factor
Channel Width after Full Scaling VLSI
​ Go Channel Width after Full Scaling = Channel Width/Scaling Factor
Mobility in Mosfet
​ Go Mobility in MOSFET = K Prime/Capacitance of Gate Oxide Layer
K-Prime
​ Go K Prime = Mobility in MOSFET*Capacitance of Gate Oxide Layer

PN Junction Depletion Depth with Drain VLSI Formula

P-n Junction Depletion Depth with Drain = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*Acceptor Concentration))*(Junction Built-in Voltage+Drain to Source Potential))
xdD = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*NA))*(Ø0+Vds))

How does the widening of the PN Junction Depletion Depth impact MOSFET performance in VLSI?

As the depletion region widens, it introduces additional resistance to the flow of charge carriers in the channel between the source and drain. This increased resistance affects the overall performance of the MOSFET, influencing parameters such as drain current, transconductance, and threshold voltage. Understanding and controlling the PN Junction Depletion Depth is crucial for optimizing MOSFET behavior in VLSI designs.

How to Calculate PN Junction Depletion Depth with Drain VLSI?

PN Junction Depletion Depth with Drain VLSI calculator uses P-n Junction Depletion Depth with Drain = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*Acceptor Concentration))*(Junction Built-in Voltage+Drain to Source Potential)) to calculate the P-n Junction Depletion Depth with Drain, The PN Junction Depletion Depth with Drain VLSI formula is defined as the extension of the depletion region into the semiconductor material near the drain terminal. P-n Junction Depletion Depth with Drain is denoted by xdD symbol.

How to calculate PN Junction Depletion Depth with Drain VLSI using this online calculator? To use this online calculator for PN Junction Depletion Depth with Drain VLSI, enter Acceptor Concentration (NA), Junction Built-in Voltage 0) & Drain to Source Potential (Vds) and hit the calculate button. Here is how the PN Junction Depletion Depth with Drain VLSI calculation can be explained with given input values -> 534466.5 = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*1E+22))*(0.76+1.45)).

FAQ

What is PN Junction Depletion Depth with Drain VLSI?
The PN Junction Depletion Depth with Drain VLSI formula is defined as the extension of the depletion region into the semiconductor material near the drain terminal and is represented as xdD = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*NA))*(Ø0+Vds)) or P-n Junction Depletion Depth with Drain = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*Acceptor Concentration))*(Junction Built-in Voltage+Drain to Source Potential)). Acceptor Concentration refers to the concentration of acceptor dopant atoms in a semiconductor material, Junction Built-in Voltage is defined as the voltage that exists across a semiconductor junction in thermal equilibrium, where no external voltage is applied & Drain to source Potential is potential between drain and source.
How to calculate PN Junction Depletion Depth with Drain VLSI?
The PN Junction Depletion Depth with Drain VLSI formula is defined as the extension of the depletion region into the semiconductor material near the drain terminal is calculated using P-n Junction Depletion Depth with Drain = sqrt(((2*[Permitivity-silicon]*[Permitivity-vacuum])/([Charge-e]*Acceptor Concentration))*(Junction Built-in Voltage+Drain to Source Potential)). To calculate PN Junction Depletion Depth with Drain VLSI, you need Acceptor Concentration (NA), Junction Built-in Voltage 0) & Drain to Source Potential (Vds). With our tool, you need to enter the respective value for Acceptor Concentration, Junction Built-in Voltage & Drain to Source Potential and hit the calculate button. You can also select the units (if any) for Input(s) and the Output as well.
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