Series Resistance from Die to Package Calculator

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✖Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction.ⓘ Thermal Resistance between junction and Ambient [Θ_j]			+10% -10%
✖Series Resistance from Package to Air is defined as the resistance experienced from package to the air.ⓘ Series Resistance from Package to Air [Θ_pa]			+10% -10%

✖Series Resistance from Die to Package is defined as the resistance experienced from die to the package.ⓘ Series Resistance from Die to Package [Θ_jp]

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Formula

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Series Resistance from Die to Package

Formula

`"Θ"_{"jp"} = "Θ"_{"j"}-"Θ"_{"pa"}`

Example

`"1.6K/mW"="3.01K/mW"-"1.41K/mW"`

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Series Resistance from Die to Package Solution

STEP 0: Pre-Calculation Summary

Formula Used

Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air
Θ_jp = Θ_j-Θ_pa
This formula uses 3 Variables

Variables Used

Series Resistance from Die to Package - (Measured in Kelvin per Watt) - Series Resistance from Die to Package is defined as the resistance experienced from die to the package.
Thermal Resistance between junction and Ambient - (Measured in Kelvin per Watt) - Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction.
Series Resistance from Package to Air - (Measured in Kelvin per Watt) - Series Resistance from Package to Air is defined as the resistance experienced from package to the air.

STEP 1: Convert Input(s) to Base Unit

Thermal Resistance between junction and Ambient: 3.01 Kelvin per Milliwatt --> 3010 Kelvin per Watt (Check conversion here)
Series Resistance from Package to Air: 1.41 Kelvin per Milliwatt --> 1410 Kelvin per Watt (Check conversion here)

STEP 2: Evaluate Formula

Substituting Input Values in Formula

Θ_jp = Θ_j-Θ_pa --> 3010-1410

Evaluating ... ...

Θ_jp = 1600

STEP 3: Convert Result to Output's Unit

1600 Kelvin per Watt -->1.6 Kelvin per Milliwatt (Check conversion here)

FINAL ANSWER

1.6 Kelvin per Milliwatt <-- Series Resistance from Die to Package

(Calculation completed in 00.004 seconds)

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Credits

Created by Shobhit Dimri

Bipin Tripathi Kumaon Institute of Technology (BTKIT), Dwarahat

Shobhit Dimri has created this Calculator and 900+ more calculators!

Verified by Urvi Rathod

Vishwakarma Government Engineering College (VGEC), Ahmedabad

Urvi Rathod has verified this Calculator and 1900+ more calculators!

< 20 CMOS Special Purpose Subsystem Calculators

Series Resistance from Die to Package

Go Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air

Series Resistance from Package to Air

Go Series Resistance from Package to Air = Thermal Resistance between junction and Ambient-Series Resistance from Die to Package

Thermal Resistance between Junction and Ambient

Go Thermal Resistance between junction and Ambient = Temperature Difference Transistors/Power Consumption of Chip

Temperature Difference between Transistors

Go Temperature Difference Transistors = Thermal Resistance between junction and Ambient*Power Consumption of Chip

Power Consumption of Chip

Go Power Consumption of Chip = Temperature Difference Transistors/Thermal Resistance between junction and Ambient

Invertor Power

Go Inverter Power = (Delay of Chains-(Electric Effort 1+Electric Effort 2))/2

Invertor Electric Effort 1

Go Electric Effort 1 = Delay of Chains-(Electric Effort 2+2*Inverter Power)

Invertor Electric Effort 2

Go Electric Effort 2 = Delay of Chains-(Electric Effort 1+2*Inverter Power)

Delay for Two Inverters in Series

Go Delay of Chains = Electric Effort 1+Electric Effort 2+2*Inverter Power

Transfer Function of PLL

Go Transfer Function PLL = PLL Output Clock Phase/Input Reference Clock Phase

Output Clock Phase PLL

Go PLL Output Clock Phase = Transfer Function PLL*Input Reference Clock Phase

Input Clock Phase PLL

Go Input Reference Clock Phase = PLL Output Clock Phase/Transfer Function PLL

Change in Phase of Clock

Go Change in Phase of Clock = PLL Output Clock Phase/Absolute Frequency

PLL Phase Detector Error

Go PLL Error Detector = Input Reference Clock Phase-Feedback Clock PLL

Feedback Clock PLL

Go Feedback Clock PLL = Input Reference Clock Phase-PLL Error Detector

Change in Frequency of Clock

Go Change in Frequency of Clock = Fanout/Absolute Frequency

Capacitance of External Load

Go Capacitance of External Load = Fanout*Input Capacitance

Fanout of Gate

Go Fanout = Stage Effort/Logical Effort

Stage Effort

Go Stage Effort = Fanout*Logical Effort

Gate Delay

Go Gate Delay = 2^(N Bit SRAM)

Series Resistance from Die to Package Formula

Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air
Θ_jp = Θ_j-Θ_pa

What is heat dissipation in packaging?

The heat generated by a chip flows from the transistor junctions where it is generate through the substrate and package. It can be spread across a heat sink, and then carried away through the air by means of convection. Just as current flow is determined by voltage difference and electrical resistance, the heat flow is determined by temperature difference and thermal resistance.

How to Calculate Series Resistance from Die to Package?

Series Resistance from Die to Package calculator uses Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air to calculate the Series Resistance from Die to Package, The series resistance from die to package formula is defined as resistance experienced from die to package. Series Resistance from Die to Package is denoted by Θ_jp symbol.

How to calculate Series Resistance from Die to Package using this online calculator? To use this online calculator for Series Resistance from Die to Package, enter Thermal Resistance between junction and Ambient (Θ_j) & Series Resistance from Package to Air (Θ_pa) and hit the calculate button. Here is how the Series Resistance from Die to Package calculation can be explained with given input values -> 0.0016 = 3010-1410.

FAQ

What is Series Resistance from Die to Package?

The series resistance from die to package formula is defined as resistance experienced from die to package and is represented as Θ_jp = Θ_j-Θ_pa or Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air. Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction & Series Resistance from Package to Air is defined as the resistance experienced from package to the air.

How to calculate Series Resistance from Die to Package?

The series resistance from die to package formula is defined as resistance experienced from die to package is calculated using Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air. To calculate Series Resistance from Die to Package, you need Thermal Resistance between junction and Ambient (Θ_j) & Series Resistance from Package to Air (Θ_pa). With our tool, you need to enter the respective value for Thermal Resistance between junction and Ambient & Series Resistance from Package to Air and hit the calculate button. You can also select the units (if any) for Input(s) and the Output as well.

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